Etching a substrate: processes – Forming or treating cylindrical or tubular article having... – Forming or treating liquid transfer cylinder or tubular...
Patent
1995-06-05
1996-11-19
Breneman, R. Bruce
Etching a substrate: processes
Forming or treating cylindrical or tubular article having...
Forming or treating liquid transfer cylinder or tubular...
216 33, 216 56, 216 99, B01D 1508
Patent
active
055759297
ABSTRACT:
A two-wafer microcapillary structure is fabricated by depositing boron nitride (BN) or silicon nitride (Si.sub.3 N.sub.4) on two separate silicon wafers (e.g., crystal-plane silicon with [100] or [110] crystal orientation). Photolithography is used with a photoresist to create exposed areas in the deposition for plasma etching. A slit entry through to the silicon is created along the path desired for the ultimate microcapillary. Acetone is used to remove the photoresist. An isotropic etch, e.g., such as HF/HNO.sub.3 /CH.sub.3 COOH, then erodes away the silicon through the trench opening in the deposition layer. A channel with a half-circular cross section is then formed in the silicon along the line of the trench in the deposition layer. Wet etching is then used to remove the deposition layer. The two silicon wafers are aligned and then bonded together face-to-face to complete the microcapillary.
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"Integrated Circuit Fabrication Technology"; Elliot; .COPYRGT.1992; McGraw-Hill; NY, NY.
Hui Wing C.
Yu Conrad M.
Breneman R. Bruce
Goudreau George A.
Main Richard B.
Sartorio Henry P.
The Regents of the University of California
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