Method for making circular diode chips through glass passivation

Details Method for making circular diode chips through glass passivation Method for making circular diode chips through glass passivation

1994-04-21

1995-03-28

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437229, 437904, 437249, H01L 21465

Patent

active

054016908

ABSTRACT:
A method for making circular diode chips which includes procedures of coating a diffused wafer with a photoresister coating and exposing it to develop the pattern; groove etching with an acid solution; removing the photoresister coating and cleaning it with deionized water; filling up the etched regions on the wafer with a glass slurry and then treating it through a glass firing process; nickel plating and sintering the wafer; mounting a sand substrate and the circular iron plates on the wafer at two opposite sides by melted wax; sand blasting the iron plate and glass substrate attached wafer and removing the iron plate so as to obtain the finished chips.

REFERENCES:
patent: 4302531 (1981-11-01), Cox et al.
patent: 5202271 (1993-04-01), Kouzuma et al.

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