Method for making circuit boards with die stamped contact pads a

Details Method for making circuit boards with die stamped contact pads a Method for making circuit boards with die stamped contact pads a

1983-11-21

1985-05-21

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

156233, 174 685, H05K 310

Patent

active

045177392

ABSTRACT:
Printed circuit boards have copper contact pads cut from copper foil and bonded to the circuit board, followed by printing circuit patterns of conductive ink on the board, the pattern connecting with the contact pads. The contact pads are cut from a copper foil strip fed with the circuit board beneath a die. Bonding of the contact pads follows, then printing of the circuit patterns. Boards can be formed from strip material in which case the individual boards are cut from the strip material.

REFERENCES:
patent: 3497410 (1970-02-01), Zagusta
patent: 3547724 (1970-12-01), Zagusta
patent: 3713944 (1973-01-01), Dennis et al.
patent: 3911716 (1975-10-01), Weglin
patent: 4045636 (1977-08-01), Yoder et al.
patent: 4465538 (1984-08-01), Schmoock

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