Metal working – Method of mechanical manufacture – Electrical device making
Patent
1991-07-19
1993-05-18
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
29832, 29840, 156902, 428901, H01K 310
Patent
active
052109410
ABSTRACT:
A double-sided printed circuit board and a method for making the circuit board. The circuit board includes a metal support that functions as both a heat sink and a ground plane. The circuit board contains a dielectric having first and second conductive foil platings on opposing sides of the dielectric. Prior to bonding the first foil plating to the metal support with a conductive adhesive, a standard protective coating on the first foil plating, which typically remains on the foil plating in conventional practice, is removed in order to expose a bare surface of the first foil plating. The exposed bare surface of the first foil plating is then bonded to the metal support before any substantial oxidation or a build up of impurities on the first foil plating surface can occur.
REFERENCES:
patent: 4294009 (1981-10-01), Quintin et al.
patent: 4496793 (1985-01-01), Hanson et al.
patent: 4499152 (1985-02-01), Green et al.
patent: 4616413 (1986-10-01), Ilrou et al.
patent: 4814040 (1989-03-01), Ozawa
Technical Information Brochures from Dow Corning.
Brochure from Arlon disclosing adhesives for electronic materials.
Dryer Joel S.
Sexson Harold L.
Turek Joseph A.
Arbes Carl J.
Poly Circuits, Inc.
LandOfFree
Method for making circuit board having a metal support does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for making circuit board having a metal support, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for making circuit board having a metal support will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-796955