Plastic and nonmetallic article shaping or treating: processes – Pore forming in situ – Including surface treatment of porous body
Patent
1995-05-24
1997-01-14
Kuhns, Allan R.
Plastic and nonmetallic article shaping or treating: processes
Pore forming in situ
Including surface treatment of porous body
264 53, 264157, 521 57, B29C 4402
Patent
active
055936245
ABSTRACT:
A method of making beaded foam molded products with corrosion inhibitor incorporated therein includes the steps of expanding a foamable synthetic resin into puffed beads, spraying onto the puffed beads a liquid containing a vapor phase corrosion inhibitor to provide a coating thereon, and molding the coated puffed beads into a beaded foam molded product with the corrosion inhibitor dispersed throughout the thickness thereof and migratable to the surface thereof.
REFERENCES:
patent: 2914377 (1959-11-01), Bull
patent: 3428720 (1969-02-01), Denslow
patent: 3767785 (1973-11-01), Bordenca
patent: 4290912 (1981-09-01), Boerwinkle et al.
patent: 4524154 (1985-06-01), Maeda et al.
patent: 4525485 (1985-06-01), Maeda et al.
patent: 4579701 (1986-04-01), Park et al.
patent: 4584175 (1986-04-01), Martenson
patent: 4656205 (1987-04-01), Walker et al.
patent: 4676939 (1987-06-01), Kuwabara
patent: 4968723 (1990-11-01), Senda et al.
patent: 4973448 (1990-11-01), Carlson et al.
patent: 5128073 (1992-07-01), Allen et al.
patent: 5139700 (1992-08-01), Miksic et al.
patent: 5154886 (1992-10-01), Franey et al.
patent: 5160025 (1992-11-01), Greenawald
patent: 5209869 (1993-05-01), Miksic et al.
patent: 5320778 (1994-06-01), Miksic et al.
LandOfFree
Method for making cellular packaging board with inhibitor does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for making cellular packaging board with inhibitor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for making cellular packaging board with inhibitor will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1385848