Etching a substrate: processes – Forming or treating article containing magnetically...
Patent
1997-05-26
1999-09-14
Utech, Benjamin
Etching a substrate: processes
Forming or treating article containing magnetically...
216102, 216100, 216 95, B44C 122
Patent
active
059518804
ABSTRACT:
A wet etching method for making calibration bump disks for use in providing quality control of production run magnetic hard disks is disclosed. It includes the steps of: (a) coating a layer of bump material on a substrate; (b) coating a photoresist layer on the layer of bump material; (c) exposing the photoresist layer to a light source under a photomask; (d) developing the photoresist layer using a developer solution to form an undeveloped photoresist layer; (e) etching the substrate containing the layer of bump material and the undeveloped photoresist layer to remove portions of the layer of bump material not covered by the undeveloped photoresist layer; and (f) stripping the undeveloped photoresist layer to leave at least a bump on the substrate which was originally covered by the undeveloped photoresist layer. The wet etching method eliminates many of the problems observed from the conventional metal mask method, including the elimination of the convex-shaped bump surface.
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"Effect of Al Micro-Bumps on the Magnetic Properties and Morphology of CoCrTa/Cr/Al Thin Films"; Chang et al.; IEEE Trans. Magn., 31(6, Pt. 1); pp. 2731-2733, (1995).
Chen Chun-Jen
Hung Joseph C-C
Lee James Hsi-Tang
Su Ming-Hung
Goudreau George
Liauh W. Wayne
Trace Storage Tech. Corp.
Utech Benjamin
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