Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1978-03-28
1979-12-18
Goolkasian, John T.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156233, 156234, 156438, 427125, 427404, 427405, 29630R, H01R 900, B65H 8100
Patent
active
041793226
ABSTRACT:
Apparatus and a method are disclosed for making bondable finger contacts (101) for application to printed circuit boards. The finger contacts are formed from a thin strip (102) of electrically conductive material. Following the application of a thin layer of contact metal (201) to the contact area, a strip of adhesive tape (109) is applied to the plated side of the contacts to protect the contacts, to interconnect and support them during subsequent handling, and to provide a compliant surface which aids in the application of the contacts to a circuit board. On an opposite side of the contacts there is applied a thermally curable adhesive (301) which, when brought into pressure contact with the circuit board and a moderate amount of heat is applied, will fasten the contacts to the board.
REFERENCES:
patent: 2468239 (1949-04-01), Saulino
patent: 2559649 (1944-03-01), Little et al.
patent: 3396461 (1968-08-01), Spooner et al.
patent: 3703603 (1972-11-01), Levesque et al.
patent: 3704515 (1969-12-01), Nelson
patent: 3938246 (1976-02-01), Over et al.
patent: 4044201 (1977-08-01), Wallick
patent: 4044460 (1977-08-01), Schachter
patent: 4044888 (1977-08-01), Schachter
patent: 4050976 (1977-09-01), Reiters
Brown Vernon L.
Greenwood Wade H.
Griffith Gary L.
Bell Telephone Laboratories Incorporated
Fisher John W.
Goolkasian John T.
Rodgers L. E.
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