Method for making beam leads

Details Method for making beam leads Method for making beam leads

1975-10-17

1976-07-27

Husar, Francis S.

Metal founding

Process

Disposition of a gaseous or projected particulate molten...

29630R, B22D 2300, H05K 314

Patent

active

039714284

ABSTRACT:
A method for making beam leads for use in the interconnecting of electronic packages to a substrate. Metal foil, such as copper, is etched to form a plurality of beam leads and then a second metal having poor adhesion with said metal foil is deposited onto the metal foil. The second metal is then separated from the metal foil and the metal foil is reuseable as a depository for another deposition of the second metal which is the desired beam leads.

REFERENCES:
patent: 3537175 (1970-11-01), St. Clair et al.
patent: 3559285 (1971-02-01), Kauffman
patent: 3750277 (1973-08-01), Happ
"Self-Adhering Metal Evaporation Mask", Keen et al., Western Electric Teccal Digest No. 5, Jan. 1967.

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