Method for making an interconnection structure for integrated ci

Details Method for making an interconnection structure for integrated ci Method for making an interconnection structure for integrated ci

1994-03-24

1995-09-26

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437225, 437180, H01L 2160

Patent

active

054534046

ABSTRACT:
A device for making temporary or permanent electrical connections to circuit pads of an integrated circuit is made with conventional semiconductor fabrication processes. The device has a supporting substrate from which project a plurality of insertion structures that are in mating alignment with corresponding circuit pads of the integrated circuit. Each insertion structure is metallized to make electrical contact with the corresponding circuit pad. The electrical contacts may be temporary or permanent depending upon the choice of metallization and the pressure applied to the contacting surfaces. The insertion structure devices have particular application for functional testing, electrical burn-in and packaging of an integrated circuit either as a full wafer or as an individual die.

REFERENCES:
patent: 4862243 (1989-08-01), Welch et al.
patent: 5048744 (1991-09-01), Chang et al.
patent: 5177439 (1993-01-01), Liu et al.
patent: 5358909 (1994-10-01), Hashiguchi et al.

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