Method for making an interconnection pin for multilayer printed

Details Method for making an interconnection pin for multilayer printed Method for making an interconnection pin for multilayer printed

1977-08-29

1979-05-22

Lanham, C. W.

29629, 29630D, B21D 5300

Patent

active

041553217

ABSTRACT:
A connector is disclosed for interconnecting multiple conductive layers in a printed circuit board. The connector includes a pair of elongated electrical terminals and a compliant section in between. A plurality of generally parallel raised pressure ridges are included on an outer surface of the compliant section. The connector may be advantageously divided into a plurality of semiseparate segments thereby enabling interconnection of an axially aligned track of printed circuit boards.

REFERENCES:
patent: 2820209 (1958-01-01), Whitted
patent: 3072880 (1963-01-01), Olsson
patent: 3420087 (1969-01-01), Hatfield et al.
patent: 3783433 (1974-01-01), Kurtz
patent: 3964813 (1976-06-01), Pizzeck
patent: 4017143 (1977-04-01), Knowles

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