Method for making an integrally molded semiconductor device heat

Details Method for making an integrally molded semiconductor device heat Method for making an integrally molded semiconductor device heat

1992-07-06

1993-10-19

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437220, 437902, H01L 2156, H01L 2158, H01L 2160

Patent

active

052545008

ABSTRACT:
A method of making a molded heat sink for plastic packages constructed for housing semi-conductor devices. Heat is removed from the semiconductor device by direct heat transfer from the device through upstanding members integrally molded in the top of the plastic housing. The integrally molded heat dissipation members facilitate cooling of the semi-conductor die which is not available by normal dissipation by convection and radiation through a generally planar external surface of the package. The molded members permit effective heat dissipation without the thermal coefficient of expansion mismatch which may occur between conventional molded packages and heat sinks secured thereto.

REFERENCES:
patent: 5057903 (1991-10-01), Olla
patent: 5108955 (1992-04-01), Ishida et al.
patent: 5147821 (1992-09-01), McShane et al.
patent: 5179039 (1993-01-01), Ishida et al.

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