Method for making an electronics module having air bridge protec

Electric heating – Metal heating – By arc

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437209, 437211, 437225, 29832, B23K 2600, H01L 2160, H05K 330

Patent

active

055480993

ABSTRACT:
In a method for preserving an air bridge structure on an integrated circuit chip, without sacrificing metallization routing area in an overlying high density interconnect structure, a protective layer is sublimed over the air bridge to provide mechanical strength while preventing contamination and deformation during processing. A high density interconnect structure is applied over the chip and protective layer. A small portion of the high density interconnect structure is removed from the area over the air bridge structure, and the protective layer is then sublimed away, leaving the resultant structure with an undamaged air bridge which is free of residue.

REFERENCES:
patent: 4783695 (1988-11-01), Eichelberger et al.
patent: 4835704 (1989-05-01), Eichelberger et al.
patent: 4878991 (1989-11-01), Eichelberger et al.
patent: 4894115 (1990-01-01), Eichelberger et al.
patent: 4933042 (1990-06-01), Eichelberger et al.
patent: 5161093 (1992-11-01), Gorczyca et al.
patent: 5331203 (1994-07-01), Wojnarowski et al.
patent: 5338975 (1994-08-01), Cole, Jr. et al.
patent: 5422513 (1995-06-01), Marcinkiewicz et al.

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