Method for making an electronic module

Details Method for making an electronic module Method for making an electronic module

1995-07-10

1998-05-05

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

29841, 29847, 29851, 29852, 174259, 174260, 257700, 428901, 437209, H05K 332

Patent

active

057459843

ABSTRACT:
A multi-chip module is provided which utilizes benzocyclobutene as a laminate adhesive for bonding the upper dielectric films in a high density interconnect structure. The benzocyclobutene thermosetting polymer is spin coated on a polyimide film, and baked at low temperature to remove any solvent to leave a B-staged coating on the polyimide film. The composite film can be laminated to an underlying electrical structure using a vacuum laminator and heat. As the heat is applied, the BCB layer softens, flows and then cures to bond the polyimide film to the underlying electrical structure.

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