Fishing – trapping – and vermin destroying
Patent
1991-10-31
1992-09-15
Chaudhuri, Olik
Fishing, trapping, and vermin destroying
437214, 437902, 26427217, H01L 2156, H01L 2158, H01L 2160, H01L 21603
Patent
active
051478218
ABSTRACT:
A method for making a semiconductor device having a heat sink is provided in which an opening through the heat sink enables a vacuum source to be applied to a semiconductor die mounting surface. In one form, a semiconductor die is attached to a mounting surface of a leadframe. The leadframe also has a plurality of leads which are electrically coupled to the semiconductor die. The semiconductor die and portions of the leads are encapsulated in a package body. Also incorporated into the package body is a heat sink. The heat sink has an opening which extends through the heat sink and exposes a portion of the mounting surface of the leadframe. The opening is used to apply a vacuum to the mounting surface during the formation of the package body so that the mounting surface and heat sink are held in close proximity. The closeness provides a good thermal conduction path from the semiconductor die to the ambient, thereby enhancing the thermal dissipation properties of the device.
REFERENCES:
patent: 4866506 (1989-09-01), Nambu et al.
patent: 4944908 (1990-07-01), Leveque et al.
Casto James J.
Joiner Bennett A.
McShane Michael B.
Chaudhuri Olik
Graybill David E.
Motorola Inc.
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