Method for making a stackable multilayer substrate for mounting

Details Method for making a stackable multilayer substrate for mounting Method for making a stackable multilayer substrate for mounting

1990-10-09

1992-03-10

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437208, 437213, 437218, 437219, 437915, H01L 2184, H01L 2190, H01L 2152, H01L 2156

Patent

active

050949691

ABSTRACT:
A substrate is formed from a core substrate of flexible, low-temeprature co-fireable ceramic tape and an outer substrate of ceramic tape having apertures for receiving integrated circuits (ICs) therein. The substrate is heated the form a rigid body which then mounts the ICs. The rigid body and ICs are covered or at least partially covered with an insulating glass and heated to a temperature that fuses the glass but does not harm the ICs. The resulting structure hermetically seals the ICs in a single substrate that is insensitive to acceleration forces.

REFERENCES:
patent: 4417392 (1983-11-01), Ibrahim et al.
patent: 4640010 (1987-02-01), Brown
patent: 4682414 (1987-07-01), Butt
patent: 4899118 (1990-02-01), Polinski, Sr
patent: 4967201 (1990-10-01), Rich, III
"IBM Technical Disclosure Bulletin"; vol. 27, No. 6, Nov., 1984 L. S. Goldmann.
Suss Report, Sep. 1988, p. 3 Rogers, Microtec Multichip Modules, A New Generation in Interconnection Technology.
H. C. Bhedwar, et al., Hybrid Circuit Technology, Low Temperature Cofireable Ceramic System with Buried Resistors and Post-Fired Metallization, May 1989, p. 31.
Corning Applications Information, Sealing Glass Corning Code 7585, issued Jun. 24, 1980.
Corning Applications Information, Sealing Glass Corning Code 7589, issued Feb., 1981.

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