Method for making a solder joint and the solder joint made there

Geometrical instruments

Patent

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Details

228135, 2281801, H01R 504

Patent

active

045305633

ABSTRACT:
The method is utilized for forming a solder joint (51-53) between a wire end portion (21-30) of a coil mounted on a hub (16) and an end tab (73) of a male or female connector (31-36) that can be mounted on a support (41-46) fixed to the hub (16). The method includes the steps of: placing at least one wire end portion (24) adjacent an end tab (73); placing an encircling ring (80; 180) of material about the end tab (73) and the at least one wire end portion (24), said ring of encircling material being sized to fit snugly about the end tab (73) and the at least one wire end portion (24) so that they are juxtaposed to each other and so that the resiliency of the at least one wire end portion (24) urging it away from the end tab (73) is sufficient to frictionally hold the ring (80; 180) of encircling material around the end tab ( 73) and the at least one wire end portion (24); inverting and dipping the assembly (78) of the end tab (73), the at least one wire end portion (24) and the ring (80; 180) of encircling material into a solder bath; and removing the assembly (53) from the solder bath and allowing it to cool and harden. The solder joint (53) includes at least one wire end portion (24) juxtaposed to a connector end tab (73) and having a ring (80; 180) of encircling material holding them together and adhered solder (86) in and around the at least one wire end portion (24), the end tab (73) and the ring (80; 180) of encircling material.

REFERENCES:
patent: 2884612 (1959-04-01), Bang
patent: 3054027 (1962-09-01), Barrick et al.
patent: 3548360 (1970-12-01), Schlueter
patent: 3609616 (1971-09-01), Dumeige
patent: 3874068 (1975-04-01), Cook
patent: 4174563 (1979-11-01), Simpson

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