Method for making a shallow junction bipolar transistor and tran

Fishing – trapping – and vermin destroying

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437192, 437193, 437200, H01L 21265

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active

051983729

ABSTRACT:
Disclosed is a process for forming a bipolar transistor at the face (22) of a semiconductor layer. A refractory metal layer (34) is deposited on the face (22) to cover a base area (38) thereof. A dopant (40) is implanted through the metal layer (34) within the base area (38) to penetrate the face (22). The metal layer (34) is then removed from the face within an emitter area (48) contained within the base area (38). A dopant is then diffused into the face within the emitter area (48). Finally, the dopants are annealed to form a shallow base region (66) that spaces an emitter region (64) from a collector region (12, 14). The process of the invention can form a high-concentration emitter/base junction only 400 Angstroms from the surface of the semiconductor layer.

REFERENCES:
patent: 3604986 (1971-09-01), Lepselter
patent: 3775192 (1973-11-01), Beale
patent: 4495512 (1985-01-01), Isaac et al.
patent: 4683645 (1987-08-01), Naguib et al.
patent: 4774204 (1988-09-01), Havemann
patent: 4788160 (1988-11-01), Havemann et al.
patent: 4816423 (1989-03-01), Havemann
patent: 4902640 (1990-02-01), Sachitano et al.

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