Method for making a semiconductor device by using capillary acti

Details Method for making a semiconductor device by using capillary acti Method for making a semiconductor device by using capillary acti

1981-10-23

1985-01-15

Hearn, Brian E.

Metal working

Method of mechanical manufacture

Electrical device making

29589, 174 52H, 228123, 228258, 357 81, H01L 2158

Patent

active

044931433

ABSTRACT:
A semiconductor member is attached to a base by placing a wafer of solder material on the base, placing a carrier member having a through capillary hole on the solder wafer, placing the semiconductor member on the carrier member and heating the arrangement whereby the solder material melts to solder the carrier member to the base, the solder material also travelling via the capillary hole to solder the semiconductor member to the carrier member.

REFERENCES:
patent: 3434018 (1969-03-01), Boczar et al.
patent: 3706915 (1972-12-01), Lootens et al.
patent: 3860949 (1975-01-01), Stoeckert et al.
patent: 3879837 (1975-04-01), Mizukoshi et al.
patent: 4143456 (1979-03-01), Inoue

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