Method for making a raw board for use in printed circuits

Details Method for making a raw board for use in printed circuits Method for making a raw board for use in printed circuits

1979-05-03

1980-11-04

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

204 38B, 204 40, C25D 510, C25D 556

Patent

active

042318483

ABSTRACT:
A method for preparing a raw board for use in printed circuits comprising the steps of first electroplating a foil or sheet of synthesized resins in an electrolytic bath containing copper sulfate, sulfuric acid, chlorine ion and a surface glazing agent including thiourea, and secondly electroplating the foil or sheet completed the above step in a conventional electrolytic bath containing copper sulfate and sulfuric acid. Also, an apparatus therefor is disclosed.

REFERENCES:
patent: 3857681 (1974-12-01), Yates
patent: 3918926 (1975-11-01), Wolski
patent: 3918927 (1975-11-01), Wells
Modern Electroplating, 2nd Edition, Edited by Frederick A. Lowenheim, 1963, pp. 172-187, 196-200.

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