Method for making a quad leadframe for a semiconductor device

Details Method for making a quad leadframe for a semiconductor device Method for making a quad leadframe for a semiconductor device

1993-07-06

1994-08-23

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29423, 437217, 437220, H01R 4300

Patent

active

053395182

ABSTRACT:
A quad leadframe (30) for a semiconductor device is made from multiple dual-in-line leadframes (10). Two dual-in-line leadframes (10) are provided, wherein each leadframe has two opposing siderails (12) with a plurality of leads (14) connected to those siderails. The leads have a metal clad layer (16) on lead tips which are distal to the two siderails. Each leadframe also has another two opposing siderails (18) which are not connected to any leads. The two leadframes are stacked on top of one another, wherein one leadframe is rotated by substantially 90.degree. with respect to the other leadframe such that the leads of one leadframe are perpendicular to the leads of the second leadframe to form a quad configuration. The siderails enable alignment of the leadframes to each other. The two leadframes can then be optionally tack welded together at any location along the siderails.

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