Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1996-10-31
1998-07-14
Lorin, Francis J.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
427 97, H05K 310
Patent
active
057798362
ABSTRACT:
Described is a method of making a double-sided printed wiring board (PWB) comprising a core of electrically conductive material to improve the thermal distribution and cross-talk shielding of the PWB. Relief apertures and separation slots are chemically milled into the core. A layer of particulate-free dielectric material and a layer of conductive material are laminated to both sides of the core and dielectric material substantially fills the relief apertures during lamination. Holes are drilled through the PWB at the relief apertures to accommodate electrical communication between both sides of the board. Holes are also drilled through the conductive material of the core to accommodate an electrical ground. The surface of the PWB and the side walls of the holes are coated with a second layer of electrically conductive material.
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