Method for making a multilayer module with high-density...

Details Method for making a multilayer module with high-density... Method for making a multilayer module with high-density...

2006-11-14

2006-11-14

Hassanzadeh, Parviz (Department: 1763)

Etching a substrate: processes

Forming or treating electrical conductor article

Forming or treating of groove or through hole

Reexamination Certificate

active

07135119

ABSTRACT:
The invention concerns a method for making a multilayer module with high-density printed circuits, which consists in: preparing a substrate (1) with double-sided printed circuits (3) whereon is bonded a single-sided plated (7) polyimide (6) additional layer using a polymerisable two-phase epoxy liquid (8); after selectively etching (9) the metal, carrying out anisotropic chemical drilling of micro-holes (12) through the polyimide film (6) by immersing the latter in a static bath of a potassium-added aqueous ethylene-diamine solution at least at 25° C.; rinsing the adhesive (8) by spraying a solvent in the base of the micro-holes (12); plating the micro-holes (12); and selectively etching the outer metallic film (7, 13) to form therein printed circuits (14) including the plated micro-holes (15).

REFERENCES:
patent: 4639290 (1987-01-01), Leyden et al.
patent: 5436062 (1995-07-01), Schmidt et al.
patent: 6016598 (2000-01-01), Middelman et al.
patent: 1134632 (1968-11-01), None
Patent Abstracts of Japan, vol. 018, No. 107 (C-1169), Feb. 22, 1994 & JP 05 301981 A (Sumitomo Metal Mining Co Ltd), Nov. 16, 1993, abstract.
Patent Abstracts of Japan, vol. 017, No. 313 (E-1381), Jun. 15, 1993 & JP 05 029768 A (Hitachi Cable Ltd), Feb. 5, 1993, abstract.
Patent Abstracts of Japan, vol. 006, No. 143 (C-117), Aug. 3, 1982 & JP 57 065727 A (Hitachi Chem. Co. Ltd; Others: 01) Apr. 21, 1982, abstract.

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