Method for making a multilayer metal leadframe

Details Method for making a multilayer metal leadframe Method for making a multilayer metal leadframe

1994-02-28

1995-08-01

Niebling, John

Metal working

Method of mechanical manufacture

Electrical device making

205140, 205145, 205206, 205222, C25D 700, H01L 23495

Patent

active

054370965

ABSTRACT:
A fabrication method and leadframe construction in which the leadframe is formed by selectively removing portions of a multilayer clad strip to expose a selected pattern of a conductive metal to conform to the desired application of the leadframe. The clad strip may be formed of a base layer of copper alloy, a conducting layer of aluminum or aluminum alloy, and an upper layer of copper or a copper alloy. A layer of tin or lead-tin alloy may be plated onto the upper layer.

REFERENCES:
patent: 4599120 (1986-07-01), Church et al.
patent: 4798932 (1989-01-01), Dion et al.
patent: 5025114 (1991-06-01), Braden
patent: 5090116 (1992-02-01), Henschen et al.
patent: 5360991 (1994-11-01), Abys et al.

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