Method for making a multilayer circuit board having embedded...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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C029S825000, C029S832000, C029S840000, C029S852000

Reexamination Certificate

active

06910264

ABSTRACT:
A method for fabricating a core circuit board having passive components, such as resistors, capacitors and inductors, is disclosed, which can be used to construct a multilayer circuit board having embedded passive components. In making such as a core circuit board, a resistive film which is a continuous or non-continuous is first formed on one side of a conductive foil. Two such conductive foils are laminated onto a high dielectric layer. The electrodes for various passive components or spiral coils for the inductive components and electrical circuit pattern are finally made on the same conductive foils simultaneously. Finally, a core circuit board having passive components for further making a multilayer circuit board is thus constructed.

REFERENCES:
patent: 4870746 (1989-10-01), Klaser
patent: 5708569 (1998-01-01), Howard et al.
patent: 5800575 (1998-09-01), Lucas
patent: 6610417 (2003-08-01), Andresakis et al.
patent: 6631551 (2003-10-01), Bowles et al.
patent: 6734542 (2004-05-01), Nakatani et al.

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