Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2001-03-23
2004-05-04
Vo, Peter (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S830000, C029S840000, C029S846000, C174S253000, C174S263000, C174S266000, C216S020000, C216S067000, C156S252000, C430S313000, C430S315000
Reexamination Certificate
active
06729023
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to a circuit board and a method for making a circuit board and more particularly, to a multi-layer electronic circuit board having metallized apertures which are selectively isolated and/or disconnected from an electrical ground plane and further having selectively formed air bridges and/or crossover circuits.
BACKGROUND OF THE INVENTION
Multi-layer circuit boards operatively receive electronic components and allow the received components to be desirably interconnected and to selectively and cooperatively form electrical circuits. Particularly, these components are operatively received upon opposed board surfaces and within certain interior portions of the board, thereby desirably allowing each of the electronic circuit boards to contain a relatively large amount of components which efficiently, respectively, and densely populate the respective boards.
It is desirable to allow each of the component containing surfaces or portions of a created and/or formed electronic circuit board to communicate and/or to be selectively interconnected, thereby allowing the contained electronic components to cooperatively and selectively form a relatively large number of desired electrical circuits. This desired communication and/or interconnection typically requires the use of shared electrical ground planes, the transmittal of electrical power and/or control type signals between some or all of the component containing surfaces or board portions, and/or the connection of components on each of the opposed surfaces and/or within and between certain of the interior portions and the top and/or bottom and/or other board surfaces.
This desired interconnection typically requires that one or more holes be formed or drilled through each of the circuit boards, thereby creating at least one “through hole” or “via” traversing between each of the opposed component containing surfaces and through the various interior circuit board portions. Typically this drilling process is relatively complex and time consuming, thereby increasing the overall circuit board production cost. This drilling process also undesirably damages and/or destroys many of the circuit boards, thereby further increasing overall production cost.
Further, it is desirable to form “air-bridges” or “crossover type circuits” upon one or more selected surfaces and/or within certain component containing portions of the formed circuit board in order to allow multiple levels of circuits and/or electrical interconnections to be formed upon a single board surface and/or within a certain component containing portion of the circuit board, thereby desirably increasing the amount of electrical circuits which may be created upon and/or within the created circuit board (e.g., increasing the density of the contained electrical circuitry).
These “air bridges” or crossover circuits are typically formed by rather complicated, costly, and time consuming processes. The formed bridges and crossover circuits further do not typically and efficiently accommodate certain desirable circuit board interconnection processes, techniques, and/or methodologies, such as and without limitation, the use of relatively heavy wire bonding (e.g., aluminum wire having a diameter of about five to about twenty milli-meters) or the direct connection of components to a surface of the board.
There is therefore a need to provide an electronic circuit board and a method for producing a multi-layer electronic circuit board which overcomes some or all of the previously delineated drawbacks of prior electronic circuit boards and methods for making a circuit board, which selectively allows grounded and non-grounded “vias” to be desirably and selectively and efficiently formed in a cost effective manner, and which further allows for the efficient and selective formation of air-bridge members or crossover circuits which desirably accommodate diverse types of circuit interconnection processes and which increase the circuitry density within the formed electronic circuit board.
SUMMARY OF THE INVENTION
It is a first object of the present invention to provide an electronic circuit board and a method for producing an electronic circuit board which overcomes some or all of the previously delineated drawbacks of prior electronic circuit boards and of prior electronic circuit board forming methodologies and techniques.
It is a second object of the invention to provide a method for producing a multi-layer electronic circuit board which overcomes some or all of the previously delineated drawbacks of prior multi-layer electronic circuit board forming methodologies and techniques, which allows for the formation or creation of an electronic circuit board which selectively receives various electronic components, which allows for the selective, efficient, and reliable formation of metalized apertures, within the formed and/or created electronic circuit board, which cooperatively allow for communication by and between these various electronic components and which further cooperatively allow for the selective interconnection of these contained components.
It is a third object of the invention to provide a method for producing a multi-layer electronic circuit board which overcomes some or all of the previously delineated drawbacks of prior multi-layer electronic circuit board forming methodologies and techniques and which allows for the selective formation of metallized apertures within a circuit board, which may be selectively connected or disconnected and/or selectively isolated from a formed electrical ground plane or bus.
It is a fourth object of the invention to provide a method for producing a multi-layer electronic circuit board which overcomes some or all of the previously delineated drawbacks of prior multi-layer electronic circuit board forming methodologies and techniques and which allows for the selective and efficient formation of air bridges and/or crossover circuits and/or crossover members which are adapted to accommodate a wide variety of component interconnection assemblies, techniques, and/or methodologies.
According to a first aspect of the invention a circuit assembly is provided comprising an electrically conductive core member having a first surface and a second surface; a first pre-circuit assembly having at least one air-bridge, the pre-circuit assembly operatively disposed upon the first surface of the electrically conductive core member; a second pre-circuit assembly having at least one air-bridge, the second pre-circuit assembly operatively disposed upon the second surface of the core electrically conductive member, thereby forming a circuit assembly having a first aperture which is electrically connected to the core metal member and a second aperture which is electrically isolated from the core metal member.
According to a second aspect of the present invention a circuit assembly is provided. The circuit assembly is made by the process of forming a first pre-circuit assembly including a first core member having a first and a second surface, a first plurality of electrically conductive members disposed upon the first surface, and a second plurality of electrically conductive members disposed upon the second surface; forming a second pre-circuit assembly having first and second circuit boards which are selectively attached to a dielectric adhesive material and which cooperatively form a separation region; coupling the dielectric adhesive material to the second plurality of electrically conductive portions; removing certain portions of the first core member, thereby forming a pedestal portion which abuts the separation region; extending the separation through the pedestal portion, thereby forming a circuit board.
According to a third aspect of the present invention a multi-layer circuit assembly is provided. The circuit assembly is made by the process of providing at least one member having an aluminum core portion which is contained between a top and a bottom layer of copper; providing at least one electrically conductive member ha
Achari Achyuta
Belke Robert Edward
Glovatsky Andrew Zachary
Goenka Lakhi N.
Gordon Robert Joseph
Chupa John G.
Law Offices of John Chupa & Assoc, PC
Trinh Minh
Visteon Global Technologies Inc.
Vo Peter
LandOfFree
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