Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal
Reexamination Certificate
2005-03-29
2009-12-08
Ha, Nathan W (Department: 2814)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
C257SE29324
Reexamination Certificate
active
07629190
ABSTRACT:
A method is disclosed for forming a micromechanical device. The method includes fully or partially forming one or more micromechanical structures multiple times on a first substrate. A second substrate is bonded onto the first substrate so as to cover the multiple areas each having one or more micromechanical structures, so as to form a substrate assembly. The substrate assembly is then separated into individual dies, each die having the one or more micromechanical structures held on a portion of the first substrate, with a portion of the second substrate bonded to the first substrate portion. Finally, the second substrate portion is removed from each die to expose the one or more micromechanical structures on the first substrate portion. The invention is also directed to a method for forming a micromechanical device, including: forming one or more micromechanical structures in one or more areas on a first substrate; bonding caps onto the first substrate so as to cover the one or more areas each having one or more micromechanical structures, so as to form a substrate assembly; after a period of time, removing the caps to expose the one or more micromechanical structures. During the period of time between bonding the caps and later removing the caps, the substrate assembly can be singulated, inspected, irradiated, annealed, die attached, shipped and/or stored.
REFERENCES:
patent: 4178077 (1979-12-01), Te Velde
patent: 4309242 (1982-01-01), Te Velde
patent: 5061049 (1991-10-01), Hornbeck
patent: 5293511 (1994-03-01), Poradish et al.
patent: 5445559 (1995-08-01), Gale et al.
patent: 5527744 (1996-06-01), Mignardi et al.
patent: 5535047 (1996-07-01), Hornbeck
patent: 5835256 (1998-11-01), Huibers
patent: 5872046 (1999-02-01), Kaeriyama et al.
patent: 5915168 (1999-06-01), Salatino et al.
patent: 5963289 (1999-10-01), Stefanov et al.
patent: 5999306 (1999-12-01), Atobe et al.
patent: 6046840 (2000-04-01), Huibers
patent: 6072236 (2000-06-01), Akram et al.
patent: 6088474 (2000-07-01), Dudasko et al.
patent: 6165885 (2000-12-01), Gaynes et al.
patent: 6172797 (2001-01-01), Huibers
patent: 6207548 (2001-03-01), Akram et al.
patent: 6232150 (2001-05-01), Lin et al.
patent: 6252229 (2001-06-01), Hays et al.
patent: 6287940 (2001-09-01), Cole et al.
patent: 6303986 (2001-10-01), Shook
patent: 6306564 (2001-10-01), Mullee
patent: 6323550 (2001-11-01), Martin et al.
patent: 6337760 (2002-01-01), Huibers et al.
patent: 6353492 (2002-03-01), McClelland et al.
patent: 6356378 (2002-03-01), Huibers
patent: 6388661 (2002-05-01), Richards
patent: 6403403 (2002-06-01), Mayer et al.
patent: 6523961 (2003-02-01), Ilkov et al.
patent: 6900072 (2005-05-01), Patel et al.
patent: 6962830 (2005-11-01), Behin et al.
patent: 7057246 (2006-06-01), Reid
patent: 2001/0007372 (2001-07-01), Akram et al.
patent: 2001/0022207 (2001-09-01), Hays et al.
patent: 2001/0034076 (2001-10-01), Martin
patent: 2003/0218753 (2003-11-01), Reuter
patent: 2003/0223084 (2003-12-01), Mehri et al.
patent: 2004/0042000 (2004-03-01), Mehri et al.
patent: 2004/0223240 (2004-11-01), Huibers
patent: 1097901 (2001-05-01), None
patent: 1101730 (2001-05-01), None
patent: 1167281 (2002-01-01), None
patent: 09159937 (1997-06-01), None
patent: 2001129800 (2001-05-01), None
patent: 2001144117 (2001-05-01), None
patent: 2001196484 (2001-07-01), None
patent: WO-01/10718 (2001-02-01), None
patent: WO-01/20671 (2001-03-01), None
patent: WO-02/12116 (2002-02-01), None
patent: WO-02/12116 (2002-02-01), None
Henry Chu, et al., “DMD superstructure Characterizations”, Jul.-Sep. 1998, pp. 75-86.
W.N. Sharpe, et al. “Tensile testing of MEMS materials-recent progress”. Journal of Materials Science 38 (2003), pp. 4075-4079.
T.E. Buchheit, et al., “Micromechanical testing of MEMS materials”, Journal of Materials Science 38 (2003), pp. 4081-4086.
S.M. Allameh, et al., “An introduction to mechanical- properties-related issues in MEMS structures”, Journal of Materials Science 38 (2003), pp. 4115-4123.
S.M. Allameh, et al., Surface topography evolution and fatigue fracture of polysilicon, Journal of Materials Science 38 (2003), pp. 4145-4155.
Ken Gall, et al., “Thermomechanical response of bare and Al2O3—nanocoated Au/Si bilayer beams for micromechanical systems” , J. Mater. Res., vol. 18, No. 7, Jul 2003, pp. 1575-1587.
Tom Glenn, et al., Packaging Microscopic Machines, Machine Design, Dec. 7, 2000.
Balaji Sridharan, et al., Post-Packaging Release a New Concept for Surface Micromachined Devices, Mechanical and Aerospace Engineering Department, 4 pgs.
U. Gosele, et al., Wafer Bonding for Microsystems Technologies, Sensors and Actuators 74 (1999) pp. 161-168.
Masao Segawa, et al., A CMOS Inage Sensoer Module Applied for a Digital Still Camera Utilizing the Tab on Glass (TOG) Bonding Method, IEEE Transactions on Advanced Packaging, vol. 22., No. 2.
In-Byeong Kang, et al., The Application of Anisotropic Conductive Films for Realisation of Interconnects in Micromechanical Structures, SPIE vol. 3321, pp. 233-238.
Sonja van der Groen, et al., CMOS Compatible Wafer Scale Adhesive Bonding for Circuit Transfer, International Conference on Solid-State Sensors and Actuators, Chicago, Jun. 16-19, 1997, pp. 629-632.
G. Blink, et al., Wafer Bonding With an Adhesive Coating, Part of the SPIE Conference on Micromachined Devices and Components IV, Santa Clara, California ,Sep. 1998, pp. 50-61.
Christine Kallmayer, et al., A New Approach to VHIP Size Package Using Meniscus Soldering and FPC-Bonding, IEEE Transactions on Components Packaging and Manufacturing Technology-Part C., vol. 21, No. 1., Jan. 1998, pp. 51-56.
Joachim Kloeser, et al., Low Cost Bumping by Stencil Printing: Process Qualification for 200 UM Pitch, 1998 International Synposium on Microelectronics, 11 Pgs.
Michel M. Maharbiz, et al., Batch Micropackaging by Conpression-Bonded Wafer-Wafer Transfer, Microassembly Technologies, Inc, 8 Pgs.
Bharat Shivkumar, et al., Microrivets for MEMS Packaging:Concept, Fabriaction, and Strength Testing, Journal of Microlectroomechanical Systems, vol. 6, No. 3, Sep. 1997, pp. 217-224.
Hideki Takagi, et al., Room Temperature Silicon Wafer Direct Bonding in Vacuum by Ar Beam Irradiation, Mechanical Engineering Laboratory, AIST. MITI., 6 Pgs.
Michael H. Beggans, et al., Optical Pressure Sensor Head Fabrication Using Ultra-Thin Silicon Wafer Anodic Bonding, Part of the Symposium on Design, Test, and Microfabrication of MEMS and MOEMS, 10 Pgs.
T.P. Glenn, et al., Designing MEMS Into Systems: Packaging Issues, http://www.ecnmag.com, 4 Pgs.
Espinosa et al., “Identification of Residual Stress State in an RF-MEMS Device”, MTS Systems Corporation white paper (May 2000).
Franka et al., “Solder Bump Technology: Present and Future”, Semiconductor Fabtech (May 1995).
Glenn et al., “Packaging Microscopic Machines”, Machine Design (Dec. 7, 2000).
Harsh et al., “Flip-Chip Assembly for Si-Based MEMS”, Proceedings of the 1999 IEEE International Conference on Microelectromechanical Systems (MEMS '99), Orlando, FL (Jan. 17-21, 1999), pp. 273-278.
Irwin at al., “Quick Prototyping of Flip Chip Assembly with MEMS ”, University of Colorado at Boulder white paper (Jul. 17, 2000).
Irwin et al., “Quick Prototyping of Flip-Chip Assembly with MEMS”, portions of slide presentation from the NSF Center for Advanced Manufacturing and Packaging of Microwave, Optical and Digital Electronics at the University of Colorado at Boulder (1998).
Lee et al., “High-Q Tunable Capacitors and Multi-way Switches Using MEMS for Millimeter-Wave Applications”, portions of slide presentation from the NSF Center for Advanced Manufacturing and Packaging of Microwave. Optical and Digital Electronics at the University of Colorado at Boulder (Sep. 1998).
Lee et al., “Use of Foundry Services to Prototype MEMS for Millimeter-wave Applications”, portions of slide presentation from the NSF Center for Advanced Manufacturing and Packaging of Microwave.
Huibers Andrew G.
Patel Satyadev R.
Bell Charles A.
Brady III Wade James
Ha Nathan W
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
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