Method for making a load resistor on a semiconductor chip

Details Method for making a load resistor on a semiconductor chip Method for making a load resistor on a semiconductor chip

1998-11-11

2000-01-04

Chaudhuri, Olik

Semiconductor device manufacturing: process

Making passive device

Resistor

438382, H01L 2100

Patent

active

060109386

ABSTRACT:
The present invention provides a new method for making a load resistor in a semiconductor chip. According to the new method, a linear-shaped doped polysilicon layer is formed onto the surface of the semiconductor chip that comprises a Si substrate and an NSG layer. This layer functions as a conductive path. A slot is formed in this layer by removing a section from the conductive path. This slot reaches down to the NSG layer effectively cutting off the polysilicon layer. Then, a rugged polysilicon layer is evenly deposited onto the surface of the slot for connection of the conductive path. The polysilicon layer over the slot and the doped polysilicon layer defines the load resistor. The result is a high resistance value with usage of only a small space.

REFERENCES:
patent: 5141597 (1992-08-01), Adams et al.

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