Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2007-08-07
2011-10-18
Richards, N Drew (Department: 2895)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
C438S034000
Reexamination Certificate
active
08039279
ABSTRACT:
One embodiment of the invention relates to a method of manufacturing a light emitting diode. The method includes forming an insulating layer on an area, not covered by a seed layer, of at least one of a p-type semiconductor layer and an n-type semiconductor layer, wherein the impurity concentration varies on the surface of the area; and immersing at least part of the seed layer into an electrolyte having metal ions which tend to reduce and deposit on the seed layer under no bias voltage.
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Chi Liang-Sheng
Chuang Chia-Ming
Huang Yu-Chieh
Huo Tai-Chan
Shao Yu-Heng
Bacon & Thomas PLLC
Epistar Corporation
Lee Jae
Richards N Drew
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