Semiconductor device manufacturing: process – Semiconductor substrate dicing
Patent
1994-05-11
1997-08-12
Thomas, Tom
Semiconductor device manufacturing: process
Semiconductor substrate dicing
438461, 438462, 438464, H01L 2158, H01L 2352, H01L 2170
Patent
active
056565470
ABSTRACT:
A flange interface for wrap-around contact regions formed in fabricating semiconductor devices provides for a durable and reliable electrical bond. A first layer having a first material is formed over the first side of a wafer. A trench is formed from the second side of the wafer such that a portion of the first layer becomes exposed in the trench. A second layer having a second material is formed over the second side of the wafer such that a portion of the second layer contacts the portion of the first layer exposed in the trench. The wafer is separated through the trench. The trench may be formed by sawing the second side of the wafer in an area where the trench is to be formed. The wafer may then be etched such that the trench is formed.
REFERENCES:
patent: 3139678 (1964-07-01), Anthony et al.
patent: 3200311 (1965-08-01), Thomas et al.
patent: 3280019 (1966-10-01), Harding et al.
patent: 3462655 (1969-08-01), Coblenz
patent: 3483308 (1969-12-01), Wakely
patent: 3559282 (1971-02-01), Lesk
patent: 3566214 (1971-02-01), Usuda
patent: 3594619 (1971-07-01), Kamoshida et al.
patent: 3602982 (1971-09-01), Kooi
patent: 3666588 (1972-05-01), Wanesky
patent: 3680205 (1972-08-01), Kravitz
patent: 3686748 (1972-08-01), Engeler et al.
patent: 3746945 (1973-07-01), Normington
patent: 3748546 (1973-07-01), Allison
patent: 3754169 (1973-08-01), Lyon et al.
patent: 3761782 (1973-09-01), Youmans
patent: 3808470 (1974-04-01), Kniepkamp
patent: 3820235 (1974-06-01), Goldman
patent: 3859127 (1975-01-01), Lehner
patent: 3886578 (1975-05-01), Eastwood et al.
patent: 3905094 (1975-09-01), Ruggiero
patent: 3944447 (1976-03-01), Magdo et al.
patent: 4033027 (1977-07-01), Fair et al.
patent: 4063176 (1977-12-01), Milligan et al.
patent: 4250520 (1981-02-01), Denlinger
patent: 4278985 (1981-07-01), Stobbs
patent: 4577213 (1986-03-01), Bauhahn
patent: 4612408 (1986-09-01), Moddel et al.
patent: 4708060 (1987-11-01), Bickes, Jr. et al.
patent: 4733290 (1988-03-01), Reardon et al.
patent: 4738933 (1988-04-01), Richards
patent: 4780424 (1988-10-01), Holler et al.
patent: 4811080 (1989-03-01), Richards
patent: 4855796 (1989-08-01), Wong et al.
patent: 4859629 (1989-08-01), Reardon et al.
patent: 4866499 (1989-09-01), Aktik
patent: 4905071 (1990-02-01), Chalifour et al.
patent: 4976200 (1990-12-01), Benson et al.
patent: 4991286 (1991-02-01), Russo et al.
patent: 5024966 (1991-06-01), Dietrich et al.
patent: 5034801 (1991-07-01), Fischer
patent: 5045503 (1991-09-01), Kobiki et al.
patent: 5063177 (1991-11-01), Geller et al.
patent: 5117280 (1992-05-01), Adachi
patent: 5139972 (1992-08-01), Neugebauer et al.
patent: 5156998 (1992-10-01), Chi et al.
patent: 5158911 (1992-10-01), Quentin
patent: 5162258 (1992-11-01), Lemnios et al.
patent: 5268310 (1993-12-01), Goodrich et al.
patent: 5280194 (1994-01-01), Richards et al.
patent: 5300461 (1994-04-01), Ting
patent: 5403729 (1995-04-01), Richards et al.
Translation of JP 54-19384 cited in a previous office action.
Richmond, D., Micro SMT Discrete Device White Paper, Micro SMT, Inc., pp. 1-14 (May 1, 1993).
Richmond, D., Micro SMT Integrated Circuit Technical White Paper, Micro SMT, Inc., pp. 1-15 (Jan. 25, 1993).
"Micro SMT, Inc. Announces A Revoluntionary IC Packaging Process," U.S. Electronics Management Report, vol. 2, Issue 3, pp. 1-3 (Mar. 1993).
Micro SMT Incorporated, Brochure, two sheets (1993).
Marcoux, P.P., et al., "Miniature SMD Packaging Simplified," Electronic Packaging & Production, pp. 74-75 (Jan. 1993).
Japanese article that refers to Micro SMT, pp. 163-169 (1993).
M-Pulse Microwave Brochure, "Micro Surface Mount Packages," one sheet (1993).
Gardner, F., "SM: Nobody said it would be this hard," Electronic Purchasing, pp. 63S and 65S (Oct. 1992).
Micro Electronics Digest, p. 14 (Spring 1993).
Manufacturing Market Insider. p. 4 (Oct. 1992).
Costlow, T., "IC package cuts cost, size," EE Times, one sheet (Aug. 3, 1992).
"Leadless Monolithic Devices are Drop-In Replacements for Beam Lead Devices," Microwave Journal, vol. 32, No. 8, pp. 173-174 (Aug. 1989).
M-Pulse Microwave Brochure, "Package Dimensions," four sheets (1991).
M-Pulse Microwave Brochure, "Microwave Schottky Ring Quads," four sheets (1989).
M-Pulse Microwave Brochure, "Series Pin Switching Elements," two sheets (1989).
M-Pulse Microwave Brochure, "Microwave Schottky Diodes," one sheet (1988).
M-Pulse Microwave Brochure, "Zero Bias Schottky Diodes," one sheet (1988).
M-Pulse Microwave Brochure, "Outline Dimensions," one sheet (1988).
M-Pulse Microwave Brochure, "PIN Diodes," one sheet (1988).
M-Pulse Microwave Brochure, "Hybrid Schottky Barrier Diodes (General Purpose)," one sheet (1988).
M-Pulse Microwave Brochure, "Step Recovery Diodes," one sheet (1988).
M-Pulse Microwave Brochure, "Microwave Tunnel Diodes," one sheet (1988).
M-Pulse Microwave Brochure, "MNOS Chip Capacitors," one sheet (1988).
M-Pulse Microwave Brochure, "Techniques for Hybrid Assembly (Application Note 220)," one sheet (1988).
Garceau, W.J., et al., "Modified Beam Lead Magnetics for Handling Semiconductors," Western Electric Technical Digest, No. 51, pp. 11-12 (Jul. 1978).
Boylestad, R., et al., Electronic Devices and Circuit Theory, Prentice-Hall, Inc., pp. v-xi, 1-24, 63-65, 82-87, 145-147, 462-488 (3rd Ed. 1982).
Gambling, W.A., Microwave Semiconductor Devices, Electronic Engineering Series, pp. 105-108 (1972).
Laverghetta, T.S., Solid-State Microwave Devices, Artech House, Inc., pp. 1-117, 178-188 (1987).
White, J.F., Microwave Semiconductor Engineering, Van Nostrand Reinhold Company Inc., pp. vii-xvii, 39-115, 364-369 (1982).
M-Pulse Microwave Advertisement, Microwaves & RF, vol. 27, No. 5, pp. 8-9 (May 1988).
Metelics Advertisement, Microwave & RF, vol. 27, No. 5, p. 262 (May 1988).
M/A-COM Advertisement, one sheet (1992).
Alpha Industries,Inc., 6 sheets of drawings that refer to "DATE Feb. 12, 1990".
Flores Hector
Richards John G.
Richmond, II Donald P.
Sander Wendell B.
ChipScale, Inc.
Radomsky Leon
Thomas Tom
LandOfFree
Method for making a leadless surface mounted device with wrap-ar does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for making a leadless surface mounted device with wrap-ar, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for making a leadless surface mounted device with wrap-ar will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-160095