Method for making a fillet for integrated circuit metal plug

Details Method for making a fillet for integrated circuit metal plug Method for making a fillet for integrated circuit metal plug

1992-02-07

1995-02-07

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437190, 437193, 437195, H01L 2144, H01L 2148

Patent

active

053875508

ABSTRACT:
A well in a semiconductor wafer is partially filled by a tungsten plug having an irregular surface. There is an aluminum line exterior of the well for electrically connecting the tungsten plug into an electrical circuit. A doped polysilicon fillet having an irregular surface meshing with the irregular surface of the tungsten plug fills the portion of the well between the plug and line, making a reproducible good electrical connection between the tungsten plug and the aluminum line. The poly fillet is formed by a poly deposit and planarization performed between a tungsten plug overetch and aluminum line deposition.

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