Method for making a direct chip attach device and structure

Details Method for making a direct chip attach device and structure Method for making a direct chip attach device and structure

2006-12-05

2006-12-05

Staicovici, Stefan (Department: 1732)

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

To produce composite, plural part or multilayered article

C264S272170, C264S273000, C264S279100, C264S328100, C438S108000, C438S112000, C438S118000, C438S122000, C438S123000, C438S127000

Reexamination Certificate

active

07144538

ABSTRACT:
A method for forming a direct chip attach device (1) includes attaching an electronic chip (3) to a lead frame structure (2), which includes a flag (18). Next, conductive studs (22) are attached to bond pads (13) on electronic chip (3) and flag (18) to form a sub-assembly (24). Sub-assembly (24) is then placed in a molding apparatus (27,47), which includes a first plate (29,49) and second plate (31,51). Second plate (31,51) includes a cavity (32,52) for receiving electronic chip (3) and flag (18), and pins (36,56). During a molding step, pins (36,56) contact conductive studs (22) to prevent encapsulating material (4) from covering studs (22). This forms openings (6) to receive solder balls (9) during a subsequent processing step.

REFERENCES:
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patent: 6081997 (2000-07-01), Chia et al.
patent: 6436736 (2002-08-01), Embong et al.
patent: 6660565 (2003-12-01), Briar
patent: 6780746 (2004-08-01), Kinsman et al.
patent: 2001-230520 (2001-08-01), None

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