Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate
2007-11-26
2010-06-01
Fourson, George (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
C438S616000, C257SE23151, C257SE23020, C257SE23026
Reexamination Certificate
active
07727813
ABSTRACT:
A method for making a device is disclosed. One embodiment provides a substrate having a first element protruding from the substrate. A semiconductor chip has a first electrode on a first surface and a second electrode on a second surface opposite to the first surface. The semiconductor chip is placed over the first element of the substrate with the first surface of the semiconductor chip facing the substrate. The second electrode of the semiconductor chip is electrically coupled to the substrate, and the substrate is at least partially removed.
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“Chinese Office Action issued Jan. 22, 2010”. for App. No. 2008010176383.
Fischer Rupert
Otremba Ralf
Schloegel Xaver
Tan Tien Lai
Dicke Billig & Czaja, PLLC
Fourson George
Infineon - Technologies AG
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