Method for making a device including placing a semiconductor...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step

Reexamination Certificate

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Details

C438S616000, C257SE23151, C257SE23020, C257SE23026

Reexamination Certificate

active

07727813

ABSTRACT:
A method for making a device is disclosed. One embodiment provides a substrate having a first element protruding from the substrate. A semiconductor chip has a first electrode on a first surface and a second electrode on a second surface opposite to the first surface. The semiconductor chip is placed over the first element of the substrate with the first surface of the semiconductor chip facing the substrate. The second electrode of the semiconductor chip is electrically coupled to the substrate, and the substrate is at least partially removed.

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“Chinese Office Action issued Jan. 22, 2010”. for App. No. 2008010176383.

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