Method for making a color image sensor with recessed contact...

Details Method for making a color image sensor with recessed contact... Method for making a color image sensor with recessed contact...

2005-11-01

2005-11-01

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Reexamination Certificate

active

06960483

ABSTRACT:
The invention relates to method for making a color image sensor. The method comprises:the formation, on the front face of a semiconductive wafer (10), of a series of active zones (ZA) comprising image detection circuits and each corresponding to a respective image sensor, each active zone being surrounded by input/output pads (22),the transfer of the wafer by its front face against the front face of a temporary supporting substrate (20),the elimination of the major part of the thickness of the silicon wafer, leaving a fine silicon layer (30) on the substrate, this fine silicon layer comprising the image detection circuits.Furthermore:firstly, layers of color filters (18) are deposited and then etched on the semiconductive layer thus thinned,secondly, prior to the transfer of the semiconductive wafer to the substrate, on the front face of the wafer, metallized apertures (25) are formed extending to a greater depth than the elements of the image detection circuits formed on the surface of the wafer, and the step of elimination of the major part of the thickness of the semiconductive wafer includes the baring, from the rear, of the metallization (22) of the metallized apertures.

REFERENCES:
patent: 5144747 (1992-09-01), Eichelberger
patent: 5250843 (1993-10-01), Eichelberger
patent: 6646289 (2003-11-01), Badehi
patent: 1 094 511 (2001-04-01), None
patent: 99 40624 (1999-08-01), None
Patent Abstract of Japan, vol. 007, No. 040 (E-159), Feb. 17, 1983 & JP 57 192052 A.

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