Method for making a chip circuit component

Details Method for making a chip circuit component Method for making a chip circuit component

1978-04-05

1981-05-19

Larson, Lowell A.

Metal working

Method of mechanical manufacture

Electrical device making

29621, 338307, H01C 1706

Patent

active

042676347

ABSTRACT:
The present method and device provides that a thickness of wet ceramic material is laid down and partially dried to provide a base. This step is followed by screen printing one or more patterns of electrical resistance material on the upper surface of the partially dried ceramic base. Thereafter a second thickness of said wet ceramic is laid down and partially dried. In the event that the fabricator desires to provide a plurality of resistance paths, or a capacitor, in a single package, the foregoing process can be repeated with additional patterns of resistance material laid down or conductor material for a capacitor laid down, on the upper layer of partially dried ceramic material. The resistance or conductor patterns are sandwiched by additional thicknesses of ceramic materials screen stacked thereon. When the desired package has been achieved, the multi layered arrangement is given a final drying and it is then diced and fired. Thereafter termination means are provided to the fired diced sections, thus making up chip components.

REFERENCES:
patent: 3193611 (1965-07-01), Huetten
patent: 3551195 (1970-12-01), Wada
patent: 4016646 (1977-04-01), Pirotte

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