Method for making a bonding tool

Metal fusion bonding – With means to handle work or product – Work portion comprises electrical component

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Reexamination Certificate

active

06860418

ABSTRACT:
A method for making a bonding tool is provided. The bonding tool includes a three dimensional surface configuration which is a mirror image of a three dimensional surface configuration of a circuit card assembly (CCA). The method includes creating a mirror image of the three dimensional surface configuration of the CCA. After producing the three dimensional surface configuration of the CCA, the method then produces a bonding tool surface with the mirror image of the three dimensional surface configuration. The mirror image of the three dimensional surface configuration isolates delicate components of the CCA during bonding and re-bonding operations of the CCA using the bonding tool.

REFERENCES:
patent: 2405778 (1946-08-01), Crawford
patent: 3172343 (1965-03-01), Jacobs
patent: 3247578 (1966-04-01), Jaremus et al.
patent: 3310388 (1967-03-01), Bennett et al.
patent: 3399332 (1968-08-01), Savolainen
patent: 3475814 (1969-11-01), Santangini
patent: 3666588 (1972-05-01), Wanesky
patent: 3698618 (1972-10-01), Heida
patent: 4995551 (1991-02-01), MacKay
patent: 5381304 (1995-01-01), Theroux et al.
patent: 5868301 (1999-02-01), Distefano et al.
patent: 6051481 (2000-04-01), Kuiken et al.
patent: 20010020636 (2001-09-01), Koskenmaki et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for making a bonding tool does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for making a bonding tool, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for making a bonding tool will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3385407

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.