Method for maintaining the buffer capacity of siliceous chemical

Details Method for maintaining the buffer capacity of siliceous chemical Method for maintaining the buffer capacity of siliceous chemical

1997-08-01

2000-02-22

Lusignan, Michael

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

216 88, 216 89, 438 5, 438 14, 438693, 451 36, 451 41, 451287, 451288, B24B 100

Patent

active

060280069

ABSTRACT:
A method for maintaining the buffer capacity of a polishing slurry during chemical-mechanical wafer polishing, the method comprising circulating the polishing slurry in a chemical-mechanical wafer polishing apparatus, monitoring the pH of the polishing slurry, combining an agent into the polishing slurry to adjust the pH of the polishing slurry and maintaining the pH of the polishing slurry within a predetermined range, thereby maintaining the buffer capacity of the polishing slurry.

REFERENCES:
patent: 5643406 (1997-07-01), Shimomura et al.
patent: 5662769 (1997-09-01), Schonauer et al.

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