Method for machining a board

Details Method for machining a board Method for machining a board

2007-04-19

2010-06-15

Phan, Thiem (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S02600B, C029S02600B, C156S275500, C408S0010BD, C408S031000

Reexamination Certificate

active

07735219

ABSTRACT:
A method for machining a board includes forming a backup board, supporting the board by the backup board and machining the board while the board is supported by the backup board. The backup board has a fibrous layer and a surface layer formed on one side of the fibrous layer, the surface layer being in contact with the board during said supporting machining the board. The backup board is formed by: forming an impregnated fibrous mat by impregnating a thermosetting adhesive into a fibrous mat of the kenaf fibers, the kenaf fibers; forming the fibrous layer having a density of about 600-900 kg/m3by curing the impregnated fibrous mat; forming a resin paper by impregnating a thermosetting resin into a paper; and forming the surface layer on said one side of the fibrous layer by curing the resin paper.

REFERENCES:
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patent: 6200074 (2001-03-01), Miller et al.
patent: 7045027 (2006-05-01), Okuzawa et al.
patent: 2004/0187998 (2004-09-01), Okuzawa et al.
patent: 2004/0224140 (2004-11-01), Ohnishi et al.
patent: 04-109137 (1992-09-01), None
patent: 11-333986 (1999-07-01), None
patent: 248610 (2002-03-01), None

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