Metal fusion bonding – Process – Bonding nonmetals with metallic filler
Patent
1984-02-08
1986-04-15
Olszewski, Robert P.
Metal fusion bonding
Process
Bonding nonmetals with metallic filler
228122, 22826312, B23K 3102
Patent
active
045822409
ABSTRACT:
A method for intermetallic diffusion bonding of piezoelectric components, wherein ceramic pieces with fired-on silver electrodes are stacked with a thin shim of solid indium alloy therebetween. The indium alloy preferably comprises 25% indium, 37.5% lead and 37.5% tin. The stack is placed under 150 psi compression and heated at a temperature of about 350.degree. for 30-48 hours in an inert gas. Almost immediately upon being heated, a liquid-solid diffusion takes place in which a small amount of the silver diffuses from the electrodes into the now liquid indium alloy. The alloy in the interface becomes saturated with silver producing a new quaternary alloy which has a higher melting point than the previous indium alloy shim. Thus, there is a gradual solidification of the alloy as the concentration of silver increases. After solidification of the new alloy during the remainder of the heating time, there is a gradual diffusion of the indium into the silver and vice versa. The bi-directional solid-solid diffusion of the indium and silver gives the bond a strength higher than known in the prior art.
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Lux Andrew A.
Schindler Gerald D.
Edgell George P.
Fox Robert J.
Gould Inc.
Olszewski Robert P.
Sachs Edward E.
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