Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent
1978-12-01
1981-07-14
Mehr, Milton S.
Metal fusion bonding
Process
Metal to nonmetal with separate metallic filler
228263A, 228263B, 228124, 174 5061, B23K 3528, H05K 506
Patent
active
042781957
ABSTRACT:
A method for low temperature bonding of silicon and silicon on sapphire and spinel to nickel and nickel steel using a layered structure with an aluminum interface between the nickel or nickel steel and the silicon. The bonding is achieved in a reducing atmosphere using a temperature of 640 to 650 degrees C. with a pressure of 100 to 150 psi on the layered structure for a period of approximately five minutes with a subsequent cooling to avoid strains in the bond. An example of the transducer apparatus utilizing such a bonding technique includes a nickel steel housing and a silicon on spinel transducer wafer having a silicon peripheral pad with an aluminum layer bonding the silicon pad to the nickel steel housing.
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Burton Lockwood D.
Halista Mitchell J.
Honeywell Inc.
Marhoefer Laurence J.
Mehr Milton S.
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