Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Depositing predominantly single metal or alloy coating on...
Reexamination Certificate
2001-06-20
2008-12-09
Tsang-Foster, Susy N (Department: 1795)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Depositing predominantly single metal or alloy coating on...
C205S123000, C205S182000, C205S224000
Reexamination Certificate
active
07462269
ABSTRACT:
A method for filling recessed microstructures at a surface of a microelectronic workpiece, such as a semiconductor wafer, with metallization is set forth. In accordance with the method, a metal layer is deposited into the microstructures with a process, such as an electroplating process, that generates metal grains that are sufficiently small so as to substantially fill the recessed microstructures. The deposited metal is subsequently subjected to an annealing process at a temperature below about 100 degrees Celsius, and may even take place at ambient room temperature to allow grain growth which provides optimal electrical properties. Various novel apparatus for executing unique annealing processes are also set forth.
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Chen Lin-Lin
Dundas Curt
Graham Lyndon W.
Ritzdorf Thomas L.
Stevens E. Henry
Leader William T
Ohriner Kenneth H.
Perkins Coie LLP
Semitool Inc.
Tsang-Foster Susy N
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