Method for low stress flip-chip assembly of fine-pitch...

Details Method for low stress flip-chip assembly of fine-pitch... Method for low stress flip-chip assembly of fine-pitch...

2011-03-01

2011-03-01

Nhu, David (Department: 2895)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S729000, C257S737000, C257SE21007, C257SE21077, C257SE21259, C257SE21261, C257SE21267, C257SE21499, C257SE21508

Reexamination Certificate

active

07898083

ABSTRACT:
A device including a first body (101) with terminals (102) on a surface (101a), each terminal having a metallic connector (110), which is shaped as a column substantially perpendicular to the surface. Preferably, the connectors have an aspect ratio of height to diameter of 2 to 1 or greater, and a fine pitch center-to-center. The connector end (110a) remote from the terminal is covered by a film (130) of a sintered paste including a metallic matrix embedded in a first polymeric compound. Further a second body (103) having metallic pads (140) facing the respective terminals (102). Each connector film (130) is in contact with the respective pad (140), whereby the first body (101) is spaced from the second body (103) with the connector columns (110) as standoff. A second polymeric compound (150) is filling the space of the standoff.

REFERENCES:
patent: 7566385 (2009-07-01), Mazur et al.
patent: 2007/0051619 (2007-03-01), Mazur et al.
patent: 2009/0087946 (2009-04-01), Masumoto

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