Method for low pressure bonding of PCD bodies

Details Method for low pressure bonding of PCD bodies Method for low pressure bonding of PCD bodies

1991-05-31

1992-05-26

Lechert, Jr., Stephen J.

Powder metallurgy processes

Powder metallurgy processes with heating or sintering

Metal and nonmetal in final product

419 17, 419 45, 419 68, G22F 700

Patent

active

051165686

ABSTRACT:
An improved temperature stable synthetic polycrystalline diamond (PCD) product includes at least one temperature stable PCD integrally and chemically bonded to a matrix carrier support through a carbide forming layer which is of a thickness of at least about 1 micron, the layer on at least one surface of the PCD is in turn is bonded to the matrix carrier. A wide variety of shapes, sizes and configurations of such products is achieved through relatively low temperature and relatively low pressure processing. Various products of various geometries are described as well as the details of the processing to achieve chemical bonding of the PCD elements in a variety of support matrix carrier materials to form a unitary structure having a temperature stability up to about 1,200 degrees C.

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