Method for locating active support circuitry on an integrated ci

Details Method for locating active support circuitry on an integrated ci Method for locating active support circuitry on an integrated ci

1999-09-24

2000-10-24

Gaffin, Jeffrey

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

257693, H01L 2348, H01L 2352, H01L 2940

Patent

active

061371815

ABSTRACT:
A method for reducing the die size of an integrated circuit by locating, on one of the four sides of the perimeter of an IC die, only the bonding pads (`standard I/O pads`) which provide I/O functionality and which must occupy a predetermined location in accordance with an industry-standard. The active support circuit associated with each of these standard I/O pads is located on one or more of the three other sides at external connection locations which are otherwise unused, or `spare`. The standard I/O pads on the first side of the IC die are connected, via wires, to the corresponding support circuitry on the other sides of the die.

REFERENCES:
patent: 3808475 (1974-04-01), Buelow et al.
patent: 4255672 (1981-03-01), Ohno et al.
patent: 5216278 (1993-06-01), Lin et al.
patent: 5329157 (1994-07-01), Rosotker

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