Method for localization of tensile residual stress and product p

Details Method for localization of tensile residual stress and product p Method for localization of tensile residual stress and product p

1990-07-02

1991-05-07

Kastler, S.

Metal treatment

Compositions

Heat treating

148902, C21D 100

Patent

active

050133705

ABSTRACT:
A metallic object is treated to produce tensile residual stress in a known localized area of the metallic object. A metallic object having at least one portion substantially free of tensile residual stress is provided, and a localized area adjacent to or a part of the tensile stress-free area is selected. The localized area is subjected to heating on one surface and cooling on the opposite surface. Upon cooling to ambient temperature, the known localized area has tensile residual stress. The localized area can have cracks formed therein by crack-promotion techniques, such as submersion in boiling magnesium chloride. The area can be tested by attaching electrodes and subjecting the area to a reversing direct current crack growth measurement procedure.

REFERENCES:
patent: 4188419 (1980-02-01), Detert et al.
patent: 4229235 (1980-10-01), Matsuda et al.
patent: 4354883 (1982-10-01), Terasaki
patent: 4772336 (1988-09-01), Enomoto et al.
"Environmental Crack Growth Measurement Techniques," Electric Power Research Institute, Report No. NP-2641, Nov., 1982.

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