Metal fusion bonding – Process – Plural joints
Reexamination Certificate
2005-07-12
2005-07-12
Silverman, Stanley S. (Department: 1754)
Metal fusion bonding
Process
Plural joints
C228S260000
Reexamination Certificate
active
06915941
ABSTRACT:
A method for locally applying solder to a set of preselected conductor areas on a printed circuit board without causing thermal damage to adjacent sensitive surface mounted devices and connectors. Before solder is applied, molten solder within a solder reservoir is pumped upwardly through a set of solder wave nozzles so as to clean and preheat the nozzles. The preselected conductor areas on the board are then aligned with the nozzles. At this time, the board is maintained at a height slightly above the nozzles to the extent that the molten solder is prevented from escaping from between the board and the nozzles. A relatively low wave of solder is produced through the nozzles to cause the low wave of solder to contact and preheat the preselected conductor areas on the board. A relatively high wave of solder is then produced through the nozzles to locally solder the preselected conductor areas on the printed circuit board.
REFERENCES:
patent: 3482755 (1969-12-01), Raciti
patent: 3834015 (1974-09-01), Di Renzo
patent: 3921888 (1975-11-01), Elliott et al.
patent: 4545520 (1985-10-01), Kent
patent: 4616775 (1986-10-01), Simonetti
patent: 5203489 (1993-04-01), Gileta et al.
patent: 5209782 (1993-05-01), Morris
patent: 5292055 (1994-03-01), Gileta
patent: 5361969 (1994-11-01), Gileta
patent: 5538175 (1996-07-01), Massini et al.
patent: 6050473 (2000-04-01), Masuda et al.
patent: 6364195 (2002-04-01), Masuda et al.
patent: 2001/0032869 (2001-10-01), Ichikawa et al.
patent: 0 269 822 (1988-06-01), None
patent: 49-70849 (1974-07-01), None
patent: 2-112876 (1990-04-01), None
patent: 8-267227 (1996-10-01), None
patent: 11-123541 (1999-05-01), None
patent: 2000-52031 (2000-02-01), None
Numata Chikara
Takaguchi Akira
Wata Masaki
Cooke Colleen P.
KTT Co., Ltd.
Senju Metal Industry Co. Ltd.
Silverman Stanley S.
Wenderoth , Lind & Ponack, L.L.P.
LandOfFree
Method for local application of solder to preselected areas... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for local application of solder to preselected areas..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for local application of solder to preselected areas... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3379150