Method for laying cut composite tape on a mold having scrap remo

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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156230, 156238, 156256, 156264, 156265, 156267, 156270, B32B 3118

Patent

active

051145197

ABSTRACT:
A composite tape laying machine removes each severed portion of a composite tape of a tape assembly from its backing that is not to be applied to a mold or the like. A removal tape of a material, which has a greater adherence to the composite tape than the backing has to the composite tape to which the composite tape is releasably adhered, is moved into engagement with each non-selected severed portion at least at the start of each non-selected severed portion. When the non-selected severed portion has a varying width, the removal tape is removed from engagement with the non-selected severed portion at the start of its maximum width. When the non-selected severed portion has a constant width, the removal tape is removed from engagement therewith substantially prior to the termination of the non-selected severed portion.

REFERENCES:
patent: 3996089 (1976-12-01), More et al.
patent: 4285752 (1981-08-01), Higgins
patent: 4531992 (1985-07-01), Eaton
patent: 4557783 (1985-12-01), Grone et al.
patent: 4627886 (1986-12-01), Grone et al.
Klein, Allen J., "Automated Tape Laying", Advanced Composites, Jan./Feb. 1989, pp. 44-52.
Ewald, Glenn W., "Two Stage Tape Placement Machine", 40th Annual Conference, Reinforced Plastics/Composites Institute, The Society of the Plastics Industry, Inc., Jan. 28-Feb. 1, 1985, Section 19-C pp. 1-5.

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