Metal treatment – Compositions – Heat treating
Patent
1977-09-06
1979-10-30
Rutledge, L. Dewayne
Metal treatment
Compositions
Heat treating
148187, 219121L, 357 23, 357 91, 427 53, H01L 21265, B23K 900
Patent
active
041727410
ABSTRACT:
Radiant energy, preferably that of a laser, is focused onto the surface of a silicon integrated circuit that contains a thin layer doped to the opposite conductivity type of the underlying silicon. The thin layer can be trimmed so as to tailor its conductivity. Such layers when used in JFET, diode, bipolar transistor, or resistor structures can therefore be precision trimmed. In particular, JFET pairs can be trimmed to a very close match.
REFERENCES:
patent: 3597579 (1971-08-01), Lumley
patent: 3801366 (1974-04-01), Lemelson
patent: 3940289 (1976-02-01), Marquardt et al.
patent: 3992819 (1976-11-01), Schmall
patent: 4059461 (1977-11-01), Fan et al.
Industrial Lasers & Their Applications, J. E. Harry, McGraw Hill, 1974, N.Y., pp. 136-138.
Uglov, "Lasers in Metallurgy . . . ," Sov. J. Quent. Electron., 4 (1974) 564.
Hutchins, "Localized . . . Diffusions . . . Laser Melting . . .," IBM-TDB, 16 (1974) 2585.
Braun et al., "Laser Adjustable Resistors . . .," Solid State Tech. 12 (1969) 56.
Ban et al., "Thin Films . . . Dielectrics . . . by Laser . . .," J. Mat. Sc. 5 (1970) 974.
National Semiconductor Corporation
Roy Upendra
Rutledge L. Dewayne
Woodward Gail W.
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