Method for laser trimming of bi-FET circuits

Metal treatment – Compositions – Heat treating

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148187, 219121L, 357 23, 357 91, 427 53, H01L 21265, B23K 900

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active

041727410

ABSTRACT:
Radiant energy, preferably that of a laser, is focused onto the surface of a silicon integrated circuit that contains a thin layer doped to the opposite conductivity type of the underlying silicon. The thin layer can be trimmed so as to tailor its conductivity. Such layers when used in JFET, diode, bipolar transistor, or resistor structures can therefore be precision trimmed. In particular, JFET pairs can be trimmed to a very close match.

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Ban et al., "Thin Films . . . Dielectrics . . . by Laser . . .," J. Mat. Sc. 5 (1970) 974.

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