Method for laser soldering

Details Method for laser soldering Method for laser soldering

1980-05-19

1982-04-27

Truhe, J. V.

Electric heating

Metal heating

By arc

219 85BM, 219121LT, B23K 2600, B23K 112

Patent

active

043272770

ABSTRACT:
A method for simultaneously soldering the two solder covered ends of an electronic chip component to respective conductor pads. Pulsed coherent laser radiation having a predetermined energy profile is separated into two spacially separate beams and they are respectively directed toward the opposing ends of the chip to reflow the solder.

REFERENCES:
patent: 3256524 (1966-06-01), Stauffer
patent: 3294951 (1966-12-01), Olson
patent: 3453097 (1969-07-01), Hafner
patent: 3463898 (1969-08-01), Takaoka et al.
patent: 3622740 (1971-11-01), Ravussin et al.
patent: 3632955 (1972-01-01), Cruickshank et al.
patent: 3893129 (1975-07-01), Endo et al.
patent: 3989778 (1976-11-01), Osborne
patent: 4020319 (1977-04-01), Shepard et al.
patent: 4069080 (1978-01-01), Osborne
patent: 4083629 (1978-04-01), Kocher et al.
patent: 4131484 (1978-12-01), Caruso et al.
Seebe, N. B., "Light Scanners", IBM Technical Disclosure Bulletin, vol. 16, No. 6, Nov. 1973, p. 1964.
Charschan et al., "Laser Scribing Apparatus", Western Electric Technical Digest, No. 20, Oct. 1970, pp. 19-20.
Eleccion, "Materials Processing With Lasers", IEEE Spectrum, Apr. 1972, pp. 62-71.
Lever, R. F., "Applying Radiant Heat to Semiconductor Integrated Circuits", IBM Technical Disclosure Bulletin, vol. 20, No. 10, Mar. 1978, pp. 3908-3909.
Martin, B. D., "Individually Flip-Chip Bonding Semiconductor Devices to a Substrate", IBM Technical Disclosure Bulletin, vol. 21, No. 5, Oct. 1978, pp. 1854-1855.

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