Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1990-08-20
1992-05-26
Beck, Shrive
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427 531, C23C 2600
Patent
active
051166410
ABSTRACT:
A method is provided for forming a thick-film circuit having at least one thick-film resistor element upon a substrate and laser scribing the substrate to remove the circuit from the remaining portion of the substrate. A thick-film circuit comprising conductor lines and at least one resistor element is first printed upon a substrate. Thereafter, the resistor element may be laser trimmed to increase the resistance value thereof. After laser trimming, a protective material such as ethyl cellulose is coated onto the outer surface of the resistor element to protect it from hot-slag ceramic material generated during a laser scribing operation. The substrate is then topside laser scribed to separate the thick-film circuit from the remaining portion of the substrate. Following laser scribing, the protective material is removed by washing the resistor element with a solvent.
REFERENCES:
patent: 3066033 (1962-11-01), Clark, III
patent: 4071639 (1978-01-01), Palmer et al.
patent: 4081653 (1978-03-01), Koo
patent: 4082830 (1978-04-01), Cogliano
patent: 4288530 (1981-09-01), Bedard
patent: 4301194 (1981-11-01), Borja et al.
patent: 4352835 (1982-10-01), Holbrook et al.
patent: 4486738 (1984-12-01), Sadlo et al.
patent: 4694568 (1987-09-01), Morelli et al.
patent: 4783421 (1988-11-01), Carlson et al.
patent: 4788523 (1988-11-01), Robbins
patent: 4931323 (1990-06-01), Manitt
Baker Jay D.
Patel Daxesh K.
Beck Shrive
Dang Vi Duong
Ford Motor Company
May Roger L.
Melotik Lorraine S.
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