Method for laminating substrate and apparatus using the method

Details Method for laminating substrate and apparatus using the method Method for laminating substrate and apparatus using the method

2007-12-03

2010-10-12

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C257SE21122, C156S060000, C156S358000

Reexamination Certificate

active

07811899

ABSTRACT:
A supporting substrate is laminated on a wafer in such a manner that the supporting substrate locked in peripheral edges with a plurality of locking claws is disposed in proximity to and facing to an adhering surface of a double-sided adhesive sheet on the workpiece, the supporting substrate is pressed by a pressing member made of an approximately hemispherical elastic body from an approximate center of a non-adhering surface of this supporting substrate, the supporting substrate is laminated by elastically deforming this pressing member on the wafer while making the supporting substrate surface contact in a flat condition.

REFERENCES:
patent: 5961768 (1999-10-01), Tsujimoto
patent: 6841027 (2005-01-01), Muffler
patent: 2007/0296035 (2007-12-01), George et al.
patent: 2000-349136 (2000-12-01), None
patent: 2002-313688 (2002-10-01), None

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